Changdian Technology Plans to Raise 6.5 Billion Yuan to Expand AI Packaging Capacity

Changdian Technology plans to raise no more than 6.5 billion yuan through a private placement of shares, aimed at expanding its advanced packaging capacity for AI chips and related technology research and development. The funds will primarily be used for the construction of production lines focused on high-density system-level packaging and wafer-level packaging for AI computing chips, in response to order demands from clients such as NVIDIA and AMD. Changdian Technology stated that the bandwidth and heat dissipation requirements for packaging technology have significantly increased for AI chips, and existing capacity is nearing full operation. This fundraising plan still requires approval from the shareholders' meeting and regulatory authorities.

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